Nano-carbon nano-carbon foil copper heatsink direct carbon nano copper heatsink thermal copper sheet copper nano-nano-fin heat sink fins copper phone | nano-carbon copper heatsink | import copper heatsink specializing in the production of graphite nanocarbon copper heat sink having a high thermal conductivity and high flexibility. Nano-carbon material is uniformly coated on copper substrate, the thermal conductivity of high thermal performance, and then by heat radiation efficiency of the carbon atoms, the heat energy is converted to infrared radio frequency, thermal transfer performance. Having a high thermal conductivity and high heat radiation efficiency. Change the thermal infrared radio frequency, communications cooling efficiency. Thermal conductivity of the film is the use of mobile phone graphite thermal film on the market today, but the cooling effect of natural graphite thermal film in general, the cost of synthetic graphite films and high and difficult to cut the high cost. Nano-carbon and graphite allotrope, cooling principle is similar to the general natural graphite thermal power at 400, artificial graphite in 1500, nano-carbon thermal power in 1000-6000. Heat is still very effective. At the same time made out of carbon nano thermal film is already finished, and processing only the open mode, punching can be, the process is very simple, low cost. Nanocarbon copper fins, which is a combination of copper and rare earth elements from a total of three layers: the heat emitting layer, a copper alloy layer, a thermal layer; good flexibility, ease of processing; EMI electromagnetic shielding and absorption, to protect sensitive electronic components; RoHS compliant, UL94V0 flammability rated; temperature properties> 100 ° C; can die-cut into custom shapes; super-radiant heat, slim, environmentally friendly, and down are insulated. Costs relative to the artificial graphite has a great advantage, and does not require wrapping treatment, a substantial decline in construction costs. Effectively reduce the loss of material, and because we have done the resin of heat emitting layer is processed to have numerous small and uniform hill-shaped protruding surface, can effectively increase the heat radiation exchange area, better heat dissipation to reach Carbon nano-copper heat sink effect parameters outlined in Table Item Test Unit Test Value Color Color Visual Specifications: Black Material Material 0.08 0.05 + Nano carbon foil thickness Thickness ASTM D374 Mm 0.05-0.40 proportion Specific Gravity ASTM D792 g / cm3 2.8 Resistance Temperature Range Continuous use Temp EN344 ℃ -40 ~ + 250 tensile strength Tensil Strength ASTM F-152 4900kpa 715PS volume resistance Volume Resistivity ASTM D257 Ω / CM 1.0 * 1012 Hardness Hardness ASTM D2240 Shore A 80 flame retardant Flame Rating UL 94 - V-0 Thermal Conductivity Conductivity ASTM D5470 w / mk 600-2500 Purpose: Electronic thermal conductivity material mobile phone, computer material